Die attach adhesive film, application method and devices incorporating the same
Patent 5372883 Issued on December 13, 1994. Estimated Expiration Date: 
July 12, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 12, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHyperconductive filled polymers Substrate attach adhesive film, application method and devices incorporating the same Thermoplastic film die attach adhesives Patent #: 5204399 InventorAssigneeApplicationNo. 090633 filed on 07/12/1993US Classes:428/323, Including a second component containing structurally defined particles257/E23.075, Conductive materials containing organic materials or pastes, e.g., for thick films (EPO)257/E23.107, Organic materials with or without thermo-conductive filler (EPO)428/105, Including grain, strips, or filamentary elements in respective layers or components in angular relation428/325, Glass or ceramic (i.e., fired or glazed clay, cement, etc.) (porcelain, quartz, etc.)428/327, Polymeric or resinous material428/411.1, COMPOSITE (NONSTRUCTURAL LAMINATE)428/426, Of quartz or glass428/704Of B, N, P, S, or metal-containing materialExaminersPrimary: Ryan, PatrickAssistant: Lee, James C. Attorney, Agent or FirmForeign Patent References
International ClassB32B 009/00AbstractA microelectronic device containing one or more dies bonded to a substrate 0.5-8 mil thick thermoplastic adhesive film is disclosed. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 30°280° C., preferably 70°-230° C. The adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.Field of SearchIncluding a second component containing structurally defined particlesGlass or ceramic (i.e., fired or glazed clay, cement, etc.) (porcelain, quartz, etc.) Including grain, strips, or filamentary elements in respective layers or components in angular relation Polymeric or resinous material COMPOSITE (NONSTRUCTURAL LAMINATE) Of quartz or glass Of B, N, P, S, or metal-containing material | |
