Method for surface treating conductive copper powder with a treating agent and coupler

Patent 5372749 Issued on December 13, 1994. Estimated Expiration Date:

March 18, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

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Inventors

Assignee

Beijing Technology of Printing Research Institute Chinese

Application

No. 033746 filed on 03/18/1993

US Classes:

252/512, Free metal containing252/514, Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum)427/216Metal base

Examiners

Primary: Owens, Terry J.

Attorney, Agent or Firm

Jacobson, Price, Holman & Stern

Foreign Patent References

0223876 EP. 06/23/1987
0239901 EP 10/23/1987
0403180 EP. 12/23/1990
60-30200 JP 02/23/1985
60-243171 JP 12/23/1985
60-258273A JP. 12/23/1985
1-297475 JP. 11/23/1989
1-304717 JP 12/23/1989
2-16172 JP 01/23/1990
2-18469 JP. 01/23/1990
3-6268 JP 01/23/1991
3-223371 JP 10/23/1991
WO89/08516 WO. 09/23/1989

International Class

H01B 001/02

Foreign Application Priority Data

1992-02-19 CN

Abstract

A method for surface treating conductive copper powder comprises dispersing pure copper powder or silver-coated copper powder in a solution of coupling agent selected from the group consisting of silane, titanate, aluminate and zirconate and a ZB-3 treating agent which is the reaction products of peanut oil fatty acids, boric acid and triethanolamine in a molar ratio of 1:1:2 in an organic solvent, the total amount of the coupling agent and ZB-3 treating agent being controlled in the range of from 0.1% to 10%, based on the weight of the copper powder, filtering after 1 hour standing and drying at 40°-60° C. under vacuum.