Method and apparatus for surface treating of substrates
Method of producing semiconductor devices Patent #: 5135608
ApplicationNo. 931377 filed on 08/18/1992
US Classes:134/1, Including application of electrical radiant or wave energy to work134/21, Including use of vacuum, suction, or inert atmosphere134/26, Using sequentially applied treating agents134/30, Including steam, gaseous agent or temperature feature257/E21.228Wet cleaning only (EPO)
ExaminersPrimary: Dees, Jose G.
Assistant: Jones, Dwayne C.
Attorney, Agent or Firm
Foreign Patent References
International ClassB08B 003/12
Foreign Application Priority Data1992-06-19 JP
AbstractA washing and drying method and apparatus which uses a washing liquid such as pure water or a solvent of the hydrocarbon type but is very high in washing effect and drying effect and allows quick drying and hence a decrease of the drying time and besides can dry a workpiece of a complicated profile uniformly. A washing liquid tank in which washing liquid is accommodated is closed airtight, and the inside of the washing liquid tank is pressurized to a pressure higher than the atmospheric pressure with gas such as air or nitrogen while the washing liquid is heated to a temperature higher than the boiling point it has under the atmospheric pressure. A workpiece to be washed is immersed in the thus pressurized heated washing liquid to wash the same. The thus washed workpiece is moved from within the washing liquid tank into an evaporating drying chamber, which is subsequently isolated airtight from the washing liquid tank. Then, the inside of the evaporating drying tank is decompressed suddenly so that the washing liquid remaining sticking to the workpiece is evaporated at a moment.