Molded plastic semiconductor package including an aluminum alloy heat spreader
September 17, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3770600 3784440 Heat transfer mechanism for integrated circuit package Method of sealing oxidized aluminum surfaces with aqueous solutions of polycarboxylic acids Semiconductor casing Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor External member for a watch Semiconductor device and method of manufacturing thereof Process for preparing a part for color anodization Method of manufacturing eprom device InventorsApplicationNo. 946119 filed on 09/17/1992US Classes:257/787, ENCAPSULATED257/675, With heat sink means257/690, With contact or lead257/706, With heat sink257/708, Entirely of metal except for feedthrough257/709, With specified insulator to isolate device from housing257/729, Portion of housing of specific materials257/E23.092Auxiliary members in encapsulations (EPO)ExaminersPrimary: Jackson, JeromeAssistant: Arroyo, Teresa M. Attorney, Agent or FirmInternational ClassesH01L 023/28H01L 023/02 H01L 023/48 H01L 029/44 AbstractThere is provided a molded plastic electronic package having improved thermal dissipation. A heat spreader, formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin. Forming a black anodization layer on the surface of the heat spreader improves both thermal dissipation and adhesion to the molding resin.Other References
Field of SearchWith heat sinkWith contact or lead ENCAPSULATED HOUSING OR PACKAGE Entirely of metal except for feedthrough Portion of housing of specific materials Predominantly titanium, vanadium, zirconium, niobium, hafnium, or tantalum nonelectrolytic coating Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.) | |
