U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method of using a metal substrate of improved surface morphology

Patent 5366598 Issued on November 22, 1994. Estimated Expiration Date: Icon_subject October 7, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Method of selective electroplating and products produced thereby
Patent #: 3948736
Issued on: 04/06/1976
Inventor: Russell

Preparation and use of electrodes in the electrolysis of alkali halides Patent #: 4572770
Issued on: 02/25/1986
Inventor: Beaver ,   et al.

Inventors

Assignee

Application

No. 132975 filed on 10/07/1993

US Classes:

205/532, Laminated or coated205/554, Sulfur containing compound produced205/630Utilizing specified electrode

Examiners

Primary: Gorgos, Kathryn

Attorney, Agent or Firm

International Classes

C25B 001/04
C25B 001/16
C25B 001/00

Abstract

A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coating application. This can be initiated by selection of a metal of desirable metallurgy and heat history, including prior heat treatment to provide surface grain boundaries which may be most readily etched. In subsequent etching operation, the surface is made to exhibit well defined, three dimensional grains with deep grain boundaries. Subsequently applied coatings, by penetrating into the etched intergranular valleys, are desirably locked onto the metal substrate surface and provide enhanced lifetime even in rugged commercial environments.

Other References

  • Hayfield, Titanium as a Substrate for Electrodes; Birmingham, Eng.; pp. 1-11; FIGS. 1-1
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