Process for etching mixed metal oxides
Patent 5356516 Issued on October 18, 1994. Estimated Expiration Date: 
February 26, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 26, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3887403 Method for patterning PLZT thin films Wet chemical etchant and method for etching high temperature superconductive films Process for multilayer printed circuit board manufacture Patent #: 5106454 InventorsAssigneeApplicationNo. 023286 filed on 02/26/1993US Classes:216/101Etching of a compound containing at least one oxygen atom and at least one metal atomExaminersPrimary: Breneman, R. BruceAssistant: Chang, Jon Attorney, Agent or FirmInternational ClassC23F 001/00AbstractAn etching process using dicarboxylic and tricarboxylic acids as chelating etchants for mixed metal oxide films such as high temperature superconductors and ferroelectric materials. Undesirable differential etching rates between different metal oxides are avoided by selection of the proper acid or combination of acids. Feature sizes below one micron, excellent quality vertical edges, and film thicknesses in the 100 Angstom range may be achieved by this method.Other References
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