U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Polymerization reactor

Patent 5355832 Issued on October 18, 1994. Estimated Expiration Date: Icon_subject December 15, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Treating polymeric surfaces
Patent #: 4072769
Issued on: 02/07/1978
Inventor: Lidel

Method for bonding silicone elastomers to metal substrates
Patent #: 4366184
Issued on: 12/28/1982
Inventor: Auerbach ,   et al.

Apparatus for processing semiconductor wafers or the like
Patent #: 4610748
Issued on: 09/09/1986
Inventor: Engle ,   et al.

Method of making a capacitor winding
Patent #: 4618507
Issued on: 10/21/1986
Inventor: Sadhir

Photoconducting amorphous carbon
Patent #: 4673589
Issued on: 06/16/1987
Inventor: Standley

Method and apparatus for automated polymeric film coating
Patent #: 4683143
Issued on: 07/28/1987
Inventor: Riley

Method of interiorly coating tubing
Patent #: 4692347
Issued on: 09/08/1987
Inventor: Yasuda

Inorganic powders with improved dispersibility
Patent #: 4810524
Issued on: 03/07/1989
Inventor: Nakayama ,   et al.

Process for applying a composite insulative coating to a substrate Patent #: 4921723
Issued on: 05/01/1990
Inventor: Nichols, et al.

Inventors

Assignee

Application

No. 990683 filed on 12/15/1992

US Classes:

118/723MW, Microwave gas energizing means (e.g., 2.45 gigahertz, microwave plasma, etc.)118/719, Multizone chamber118/723E, Having glow discharge electrodes (e.g., DC, AC, RF, etc.)118/730Rotary

Examiners

Primary: Breneman, R. Bruce
Assistant: Baskin, Jonathan D.

Attorney, Agent or Firm

International Class

C23C 016/50

Abstract

An apparatus adapted for depositing one or more polymeric materials on the surface of a substrate, which apparatus includes a polymerization chamber; an inlet for admitting a glow discharge polymerization precursor into the polymerization chamber; a first conductive member extending into the polymerization chamber; a first conductive support attached to the first conductive member for holding a substrate; a power generator arranged for transmitting electrical energy to the first conductive member; a second conductive member on or within the polymerization chamber, the second conductive member being spaced and insulated from the first conductive member; and a pump arranged for applying a vacuum to the polymerization chamber; whereby a glow discharge zone is established within the polymerization chamber when a vacuum is applied thereto and electrical energy from the first conductive member is received by the second conductive member. Also disclosed are a process of depositing polymeric materials on the surface of a substrate, which can be conveniently practiced using the above-described apparatus, and a product thereof.

Other References

  • T. I. Kamins et al., "Proporties of Plasma-Enhanced CVD Silicon Films", J. Electrochem. Sec.: Solid-State Science and Technology, vol. 129, No. 10, pp. 2326-2331
  • Sadhir et al., The adhesion of glow-discharge polymers, Silastic and Parylene to implantable platinum electrodes: results of tensile pull tests after exposure to isotonic sodium chloride, Biomaterials 1981 vol. 2 Oct., pp. 239-243
  • Riley et al., Investigation into the Effect of Plasma Pretreatment on the Adhesion of Parylene to Various Substrates, Cleveland Electrical/Electronic Conference, May 20-22, 1980, pp. 93-99, May 20-22, 1980
  • Loh et al., Plasma Enhanced Parylene Deposition, ANTEC (1991), pp. 1099-1103
  • Sharma et al., Effect of glow discharge treatment of substrates on parylene-substrate adhesion, J. Vac. Sci. Technol., 21(4), Nov./Dec. 1982, pp. 994-997
  • Technical Data Sheet (No. 781OBS, APSB-Series Plasma System) and a blue print (advertizing materials received in Apr, 1988, from Advance Plasma Systems, Inc. St. Petersburg, F
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