Adjustable height work holder for bonding semiconductor dies
Patent 5340011 Issued on August 23, 1994. Estimated Expiration Date: 
December 9, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 9, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesUltrasonic wire bonding chuck Patent #: 3995845 InventorAssigneeApplicationNo. 988299 filed on 12/09/1992US Classes:228/4.5, Wire lead bonder228/49.5, Work portion comprises electrical component228/56.5WITH SIGNAL, INDICATOR, GAUGE, OR STOPExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmForeign Patent References
International ClassB23K 037/04AbstractIn a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.Other References
Field of SearchWire lead bonderWith electrical connection made at joint MEANS TO APPLY VIBRATORY SOLID-STATE BONDING ENERGY (E.G., ULTRASONIC, ETC.) TO WORK Using optical viewing means (e.g., microscope) WITH SIGNAL, INDICATOR, GAUGE, OR STOP Work portion comprises electrical component Screw means Set screw type | |
