Ultrasonic wire bonding chuck Patent #: 3995845
ApplicationNo. 988299 filed on 12/09/1992
US Classes:228/4.5, Wire lead bonder228/49.5, Work portion comprises electrical component228/56.5WITH SIGNAL, INDICATOR, GAUGE, OR STOP
ExaminersPrimary: Heinrich, Samuel M.
Attorney, Agent or Firm
Foreign Patent References
International ClassB23K 037/04
AbstractIn a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.
Field of SearchWire lead bonder
With electrical connection made at joint
MEANS TO APPLY VIBRATORY SOLID-STATE BONDING ENERGY (E.G., ULTRASONIC, ETC.) TO WORK
Using optical viewing means (e.g., microscope)
WITH SIGNAL, INDICATOR, GAUGE, OR STOP
Work portion comprises electrical component
Set screw type