Single in-line optical package
November 30, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for manufacturing a module for a fiber optic link Optoelectronic connector assembly Module for a fiber optic link Duplex optical communication device Fiber optic receiver module Subassembly for optoelectronic devices Packaging techniques for optical transmitters/receivers Photointerrupter Removable optical interconnect for electronic modules Molded optical packaging arrangement InventorsAssigneeApplicationNo. 984062 filed on 11/30/1992US Classes:385/90, Fiber adjustable relative to device385/52, With alignment device385/89, Plural fiber/device connections385/93Including lensExaminersPrimary: Lee, John D.Attorney, Agent or FirmInternational ClassG02B 006/42AbstractAn optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components. The technique as disclosed is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices and electronics (transceiver), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials and metallized bond pad sites, solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device, coupling lens and associated optical fiber.Field of SearchFiber to thin film devicesWaveguide to waveguide Permanently fixed coupler With alignment device Optical fiber to a nonfiber optical device connector Plural fiber/device connections Fiber adjustable relative to device Fiber permanently fixed after adjustment With housing Including lens Sealed from environment INTEGRATED OPTICAL CIRCUIT With particular lead geometry For plural devices With discrete components Outside periphery of package having specified shape or configuration | |
