Automatic wafer lapping apparatus
Patent 5333413 Issued on August 2, 1994. Estimated Expiration Date: 
December 15, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 15, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesApparatus for handling workpieces such as semiconductor substrates Polishing machine Workpiece carrier means for surface grinding machine Honing, lapping or polishing machine Automatic wafer lapping apparatus Patent #: 5174067 InventorAssigneeApplicationNo. 991797 filed on 12/15/1992US Classes:451/9, Of tool or work holder position451/269, Rotary work holder451/287, Planar surface abrading451/290, Disk or wheel abrader451/334, Reciprocating451/339Ejector or unloaderExaminersPrimary: Lavinder, JackAttorney, Agent or FirmForeign Patent References
International ClassesB24B 007/04B24B 007/22 281 SF 11 R 117 118 Foreign Application Priority Data1991-12-18 JPAbstractAn automatic wafer lapping apparatus including: a lapping assembly consisting of an upper lapping plate, a lower lapping plate and wafer carriers; a loader assembly installed in the vicinity of the lapping assembly; an unloader assembly installed in the vicinity of the lapping assembly; and a robot having wafer holder member for holding a plurality of wafers and for transferring the wafers between the loader assembly and the unloader assembly and the lapping assembly, WHEREIN the wafer lapping assembly further includes a position sensor for detecting the position of the carriers and a device for cleaning the wafer holder, and the robot consists of a single-handed arm and the wafer holder supported at the fore end of the arm of the robot which can hold wafers one by one. | |
