Lead-free, high temperature, tin based multi-component solder
Patent 5328660 Issued on July 12, 1994. Estimated Expiration Date: 
June 16, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 16, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3607253 Tin based ductile brazing alloys Tin based ductile brazing alloys Low toxicity corrosion resistant solder Soft-solder alloy for bonding ceramic articles Tin base lead-free solder composition containing bismuth, silver and antimony Low toxicity alloy compositions for joining and sealing Patent #: 4929423 InventorsApplicationNo. 079111 filed on 06/16/1993US Classes:420/562, Antimony, or bismuth containing148/400, STOCK420/559, Antimony, or bismuth containing420/561Antimony, or bismuth containingExaminersPrimary: Dean, R.Assistant: Vincent, Sean Attorney, Agent or FirmInternational ClassC22C 013/00AbstractDisclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.Other References
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