U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Monolithic IC formed of a CCD, CMOS and a bipolar element

Patent 5319235 Issued on June 7, 1994. Estimated Expiration Date: Icon_subject August 13, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Semiconductor device capable of withstanding high voltage and method of manufacturing same
Patent #: 4089021
Issued on: 05/09/1978
Inventor: Sato, et al.

Isolation of integrated circuits utilizing selective etching and diffusion
Patent #: 4140558
Issued on: 02/20/1979
Inventor: Murphy ,   et al.

Silicon base CCD-bipolar transistor compatible methods and products
Patent #: 4152715
Issued on: 05/01/1979
Inventor: Wang

Integrated circuit device
Patent #: 4163245
Issued on: 07/31/1979
Inventor: Kinoshita

Wave shaping circuit
Patent #: 4230951
Issued on: 10/28/1980
Inventor: Suzuki ,   et al.

Charge pump substrate bias generator
Patent #: 4255677
Issued on: 03/10/1981
Inventor: Boonstra ,   et al.

Charge transfer device having an improved read-out portion
Patent #: 4672645
Issued on: 06/09/1987
Inventor: Bluzer ,   et al.

Isolation regions formed by locos followed with groove etch and refill
Patent #: 4746963
Issued on: 05/24/1988
Inventor: Uchida ,   et al.

CMOS integrated circuit and process for producing an electric isolation zones in said integrated circuit
Patent #: 4786960
Issued on: 11/22/1988
Inventor: Jeuch

MOS/bipolar device with stepped buried layer under active regions
Patent #: 4799098
Issued on: 01/17/1989
Inventor: Ikeda ,   et al.

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Inventors

Application

No. 928084 filed on 08/13/1992

US Classes:

257/370, Combined with bipolar transistor257/215, Charge transfer device257/369, Complementary insulated gate field effect transistors257/506, Including dielectric isolation means257/510, Dielectric in groove257/E21.696Bipolar and MOS technologies (EPO)

Examiners

Primary: Hille, Rolf
Assistant: Fahmy, Wael

Attorney, Agent or Firm

Foreign Patent References

  • 60-132367 JP. 07/13/1985

International Classes

H01L 029/76
H01L 029/94
H01L 029/00

Foreign Application Priority Data

1989-11-21 JP

Abstract

A composite semiconductor element includes a semiconductor substrate having a single crystal region projecting in the form of an island, an epitaxial growth layer formed on the semiconductor substrate so as to surround the single crystal region, an insulating isolation layer formed in predetermined regions of the epitaxial growth layer, of the single crystal region, and of the semiconductor substrate so as to insulate/isolate the epitaxial growth layer and the single crystal region from each other and to form a plurality of island-like element regions in the epitaxial growth layer and in the single crystal region, an n-channel MOS transistor and a CCD element respectively formed in element regions in the single crystal region, and a p-channel MOS transistor and a bipolar element respectively formed in element regions in the epitaxial growth layer.

Other References

  • Peter Van Zant, "Microchip Fabrication", Second Edition, Chapter Eleven, pp. 266-267 and Chapter Twelve--p. 314
  • "Video Camera Signal Processing IC with CCD Delay Lines", T. Kiyofuji et al., CH2871-2/90/0000-0342-1990 IEEE, pp. 342-34
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