Heat sink assembly for solid state devices
Patent 5313099 Issued on May 17, 1994. Estimated Expiration Date: 
March 4, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 4, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2432513 2916159 2958515 3033537 3146384 3182114 3229756 3417300 Heat dissipator for integrated circuit chips Diamond heatsink assemblies InventorsAssigneeApplicationNo. 026515 filed on 03/04/1993US Classes:257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/706, With heat sink257/718, Heat dissipating element held in place by clamping or spring means257/719, Pressed against semiconductor element257/727, Device held in place by clamping257/E23.084, With bolts or screws (EPO)257/E23.086Snap-on arrangements, e.g., clips (EPO)ExaminersPrimary: Jackson, JeromeAssistant: Arroyo, T. M. Attorney, Agent or FirmInternational ClassesH01L 023/02H01L 023/42 H01L 023/44 H01L 023/40 AbstractA heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. An alternate embodiment shows the heat sink which has a snap on flange to attach the heat sink to the adaptor.Field of SearchWith heat sinkWith semiconductor element forming part (e.g., base, of housing) Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element Device held in place by clamping Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) | |
