Method of producing epoxy resin film
Patent 5304399 Issued on April 19, 1994. Estimated Expiration Date: 
February 25, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 25, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3306872 Solventless process for producing resinous materials Preparation of epoxy resins having low undesirable halogen content Epoxy compounds and epoxy resin compositions containing the same Sulfide containing aliphatic epoxy resins Patent #: 4921927 InventorsAssigneeApplicationNo. 022271 filed on 02/25/1993US Classes:427/386, Epoxy or polyepoxide containing coating264/216, Rubber or synthetic resin containing liquid264/331.11, Synthetic resin containing264/331.12Polymer having heterocyclic group or polymer derived from monomer having heterocyclic group except heterocyclic derived solely from carboxylic acid (i.e., cyclic imide, lactam, lactone, or anhydride)ExaminersPrimary: Owens, Terry J.Assistant: Cameron, Erma Attorney, Agent or FirmForeign Patent References
International ClassB05D 001/18Foreign Application Priority Data1990-09-11 JPAbstractAn epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80° to 130° C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.Other References
Field of SearchEpoxy or polyepoxide containing coatingRubber or synthetic resin containing liquid Synthetic resin containing Polymer having heterocyclic group or polymer derived from monomer having heterocyclic group except heterocyclic derived solely from carboxylic acid (i.e., cyclic imide, lactam, lactone, or anhydride) | |
