U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Dielectric films for use in magnetoresistive transducers

Patent 5302461 Issued on April 12, 1994. Estimated Expiration Date: Icon_subject June 5, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3860965

3862017

Magnetoresistive read head assembly for servo operation
Patent #: 4012781
Issued on: 03/15/1977
Inventor: Lin

Thin film magnetic heads and substrates therefore
Patent #: 4660114
Issued on: 04/21/1987
Inventor: Yamakawa ,   et al.

Lift-off process for patterning shields in thin magnetic recording heads
Patent #: 4853080
Issued on: 08/01/1989
Inventor: Anthony

Method for making a magnetoresistive read transducer
Patent #: 4940511
Issued on: 07/10/1990
Inventor: Fontana, Jr., et al.

Amorphous oxide film and article having such film thereon Patent #: 5110637
Issued on: 05/05/1992
Inventor: Ando, et al.

Inventor

Application

No. 894398 filed on 06/05/1992

US Classes:

428/472, Refractory metal salt or oxide257/E43.004, Magnetic-field-controlled resistors (EPO)360/122, Head surface structure360/315, Having multiple interconnected single film MR sensors (e.g., dual magnetoresistive sensor)360/320, Detail of head insulation428/701, O-containing metal compound428/702O-containing

Examiners

Primary: Turner, A. A.

Foreign Patent References

  • 0013363 EP. 07/13/1980
  • 0108940 EP. 05/13/1984
  • 2091468A GB 07/13/1982

International Class

G11B 005/30

Abstract

A new class of materials for use as a dielectric to separate various metallic layers within a magnetoresistive transducer. The materials include oxides of Ta, Hf, Zr, Y, Ti, or Nb. Thin films of these materials, when fabricated in accordance with the teachings of the invention, constitute dielectric films which maintain their integrity as insulators at thicknesses down to 5 nm. Additionally, the adhesion of this class of dielectrics equals or exceeds that of commonly used dielectrics.

Other References

  • N. Sangyo, "Thermo International Labratory", Nov. 11, 1991, Japanese Daily Report, p. 1
  • K. Ramesh et al., "Process Dependence of Breakdown Filed in Thermally Nitrided Silicon Dioxide", Aug. 1991, Appl. Phys. 70(4), pp. 2299ࣙ2303
  • J. Yamazaki, "Highly stable tantalum thin Film CR Circuit on a Single Substrate", Dec. 1970, Fujitsu Scientific & Tech. Journal, pp. 117-133
  • Patent Abstracts of Japan, vol. 16, No. 80, Feb. 26, 1992 & JP-A-32,68,216 Hitachi Ltd., Nov. 28, 199
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