Method for applying a coating solution
June 1, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 896111 Method for rapidly forming photoconductive layers for integrated circuits White electrosensitive paper Dropout boot for power recovery train Process for preparing electrostatographic photosensitive device comprising sodium additives and trigonal selenium particles Apparatus and method for drying and curing coated substrates Multiple nozzle jet finishing Imaging members with photogenerating compositions obtained by solution processes Automotive coating treating process Electrophotographic photosensitive member and a method of preparing it InventorsAssigneeApplicationNo. 891091 filed on 06/01/1992US Classes:427/543, Induction or dielectric heating427/58, ELECTRICAL PRODUCT PRODUCED427/348, Gas jet or blast mechanically treats coating427/372.2, Heating or drying (e.g., polymerizing, vulcanizing, curing, etc.)427/443.2, Inorganic base427/544, Organic coating containing material427/591Induction or dielectric heatingExaminersPrimary: Pianalto, BernardAttorney, Agent or FirmForeign Patent References
International ClassB05D 003/02AbstractA method for applying a coating solution onto a substrate to form a coated portion thereon includes a dipping device for dipping and removing the substrate into and from the coating solution; and a heating device for inductively heating the substrate while the dipping device removes the substrate from the coating solution to uniformly dry an inner surface of the coated portion, the inner surface being adjacent to the substrate. The method advantageously may include a drying device for blowing hot gases onto the coated portion of the substrate while the dipping device removes the substrate from the coating solution. The drying device for blowing hot gases onto the coated portion of the substrate includes a plurality of slits arranged so that a plurality of hot gas streams flowing through corresponding ones of the plurality of slits impinge and exert a gas pressure on the coated portion, the plurality of slits being arranged so that a collective gas pressure from all hot gas streams is uniformly applied across the coated portion along a transverse direction so that the coated portion is squeezed to a uniform thickness as the dipping device removes the substrate.Other References
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