Solder interconnection structure on organic substrates and process for making
Patent 5292688 Issued on March 8, 1994. Estimated Expiration Date: 
June 1, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 1, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSolder interconnection structure and process for making Patent #: 5089440 InventorsApplicationNo. 890798 filed on 06/01/1992US Classes:29/840, By metal fusion29/841, With encapsulating, e.g., potting, etc.257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.007, Organic substrates, e.g., plastic (EPO)257/E23.121Containing filler (EPO)ExaminersPrimary: Hearn, Brian E.Assistant: Dang, Trung Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/20AbstractSolder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.Other References
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