Multilayer wiring board, interlevel connector, and method for making same
May 28, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesAnisotropic resistance bonding technique Interconnectors Versatile electrical fiber brush and method of making Electric connector of press-contact holding type Electroconductive rubbery member and elastic connector therewith Production of resistor from insulating material by local heating Conductive brush paper position sensor Compliant interconnection and method therefor Plastic article containing electrically conductive fibers Method of forming conductor path InventorsAssigneeApplicationNo. 068267 filed on 05/28/1993US Classes:174/262, Feedthrough174/264, Voidless (e.g., solid)361/785With separable connector or socket meansExaminersPrimary: Picard, Leo P.Assistant: Figlin, Cheryl R. Attorney, Agent or FirmInternational ClassH05U 001/00AbstractAn interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.Other References
Field of SearchPreformed panel circuit arrangement (e.g., printed circuit)With particular conductive connection (e.g., crossover) Feedthrough Voidless (e.g., solid) Conductor is compressible and to be sandwiched between panel circuits INCLUDING ELASTOMERIC OR NONMETALLIC CONDUCTIVE PORTION Adapted to be sandwiched between preformed panel circuit arrangements Monolayer with structurally defined element SELF-SUSTAINING CARBON MASS OR LAYER WITH IMPREGNANT OR OTHER LAYER PRINTED CIRCUIT | |
