Three-dimensional memory card structure with internal direct chip attachment
January 29, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInformation card Printed circuit board Method of and apparatus for crushing earth under the ground Electronic memory card IC card Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom Card provided with a microprocessor and/or at least one electronic memory Packaging system for multiple semiconductor devices Printed wiring board for mounting electronic parts and process for producing the same Packaging system for stacking integrated circuits InventorApplicationNo. 827255 filed on 01/29/1992US Classes:257/723, For plural devices257/691, Having power distribution means (e.g., bus structure)257/706, With heat sink257/720, Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)257/724With discrete componentsExaminersPrimary: Clark, Sheila V.Attorney, Agent or FirmInternational ClassesH01L 023/16H01L 023/02 H01L 023/12 AbstractA card structure has an internal three dimensional array of implanted semiconductor chips. The card structure includes a power core and a plurality of chip cores. Each chip core is joined to the power core on opposite surfaces of the power core, and each chip core includes a compensator core having a two dimensional array of chip wells. Each chip well allows for a respective one of the semiconductor chips to be implanted therein. Further, a compliant dielectric material is disposed on the major surfaces of the compensator core except at the bottoms of the chip wells. The compliant dielectric material has a low dielectric constant and has a thermal coefficient of expansion compatible with those of the semiconductor chips and the compensator core, so that thermal expansion stability with the chips and the compensator core is maintained.Field of SearchFor plural devicesWith discrete components With electrical isolation means Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) Liquid coolant For integrated circuit Stacked arrangement WITH MEANS TO PREVENT INSPECTION OF OR TAMPERING WITH AN INTEGRATED CIRCUIT (E.G., "SMART CARD", ANTI-TAMPER) Smart (e.g., credit) card package Having power distribution means (e.g., bus structure) With heat sink Configuration or pattern of bonds With specific electrical feedthrough structure | |
