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ApplicationNo. 965119 filed on 10/22/1992
US Classes:165/80.5, Including liquid heat exchange medium165/80.1, WITH RETAINER FOR REMOVABLE ARTICLE165/80.4, Liquid cooled165/168, CONDUIT WITHIN, OR CONFORMING TO, PANEL OR WALL STRUCTURE430/330Including heating
ExaminersPrimary: Ford, John M.
Attorney, Agent or Firm
Foreign Patent References
International ClassesF28F 003/12
AbstractA liquid filled hot plate used in integrated circuit fabrication baking processes. The hot plate uses heated liquid which is pumped throughout a circulatory system, for heating the hot plate. The hot plate has a cavity which has symmetrical parallel partitions dividing the cavity into equal halves, where the inlet fluid line determines the left and right halves. Therefore, temperature control of the hot plate can be achieved to +/-0.25 degrees C., and temperature spiking phenomenon can be depreciated.