U.S. patents available from 1976 to present.
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Method and apparatus for detecting defect on semiconductor substrate surface

Patent 5271796 Issued on December 21, 1993. Estimated Expiration Date: Icon_subject March 27, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Method for detecting crystal defects in semiconductor silicon and detecting solution therefor Patent #: 4243473
Issued on: 01/06/1981
Inventor: Yamaguchi ,   et al.

Inventors

Application

No. 858700 filed on 03/27/1992

US Classes:

438/16, Optical characteristic sensed252/79.5Alkali metal hydroxide containing

Examiners

Primary: Powell, William A.

Attorney, Agent or Firm

Foreign Patent References

  • 0247771 DE 07/13/1987
  • 59-75640 JP 04/13/1984
  • 0122648 JP 06/13/1986

International Classes

H01L 021/306
B44C 001/22

Foreign Application Priority Data

1991-03-27 JP

Abstract

A method of detecting a defect on the surface of a semiconductor substrate, including: a first etching step of etching a semiconductor substrate by a first etching amount; a first check step of applying a beam to the surface of the substrate underwent the first etching step, and detecting a first reflected beam; a second etching step of etching the substrate etched by the first etching amount, by an additional etching amount, to make the total etching amount a second etching amount; a second check step of applying the beam to the surface of the substrate underwent the second etching step, and detecting a second reflected beam; and a calculation step of calculating the relation between the first and second reflected beams.

Other References

  • Miyashita et al. (1991) Electrochem. Soc. Extended Abstracts 91-1:286-287, Abstract No. 204: Origin of Surface Micro Defect on Annealed Silicon Wafe
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