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US Patent 5256370 - Lead-free alloy containing tin, silver and indium

US Patent Issued on October 26, 1993
Estimated Patent Expiration Date: Icon_subject May 4, 2012Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Abstract

A low melting point solder alloy comprising effective amounts of tin, silver and indium.

Other References

  • Rhines et al., Constitution of the System Indium-Tin, pp. 1-20, Paper Presented at the 28th Annual Convention of the American Society for Metals (1946)
  • Ludwick, Indium, pp. 21-151, The Indium Corporation of America (1959)
  • Manko, Solders and Soldering, pp. 115-123, McGraw Hill Book Company (2nd ed. 1979)
  • Assembly Joining Handbook, Low Melting Temperature Solders, The Institute for Interconnecting and Packaging Electronic Circuits (Dec. 1983)
  • The Indium Corporation of America, Indalloy Specialty Solders & Alloys (1988)
  • The Indium Corporation of America, Indalloy Fusible Alloys (1988)
  • Federal Specification, Solder; Tin Alloy, Tin-Lead Alloy, and Lead Alloy, QQ-S-571E (Interim Amendment 5 (ER) 28 Dec. 1989)
  • Stevens & White, Properties and Selection: Indium and Bismuth, Metals Handbook, vol. 2 (10th ed. 1990)
  • Soldering of Electronic Products, Lead Industries Association Inc. (1991

Inventors

Assignee

Application

No. 878050 filed on 05/04/1992

US Classes:

420/557, TIN BASE219/146.22Nonferrous

Field of Search

420/557, TIN BASE219/146.22Nonferrous

Examiners

Primary: Yee, Deborah

US Patent References

1565115, 1934730, 2157933, 2306667, 2464821, 2532265, 2623273, 3184303, 3503721, 3627517, 3833362, 4268585, Soldering to a gold member
Issued on: 05/19/1981
Inventor: Daur ,   et al.
4670217, Solder composition
Issued on: 06/02/1987
Inventor: Henson ,   et al.
4695428, Solder composition
Issued on: 09/22/1987
Inventor: Ballentine ,   et al.
4778733, Low toxicity corrosion resistant solder
Issued on: 10/18/1988
Inventor: Lubrano ,   et al.
4797328, Soft-solder alloy for bonding ceramic articles
Issued on: 01/10/1989
Inventor: Boehm ,   et al.
4806309, Tin base lead-free solder composition containing bismuth, silver and antimony
Issued on: 02/21/1989
Inventor: Tulman
4879096, Lead- and antimony-free solder composition
Issued on: 11/07/1989
Inventor: Naton
5052489Apparatus for selectively actuating well tools
Issued on: 10/01/1991
Inventor: Carisella, et al.

International Class

C22C 013/00

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