Lead-free alloy containing tin, silver and indium
Patent 5256370 Issued on October 26, 1993. Estimated Expiration Date: 
May 4, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 4, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorsAssigneeApplicationNo. 878050 filed on 05/04/1992US Classes:420/557, TIN BASE219/146.22NonferrousExaminersPrimary: Yee, DeborahInternational ClassC22C 013/00AbstractA low melting point solder alloy comprising effective amounts of tin, silver and indium.Other References
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