Patent References 3427861 3433052 3451254 3672221 3745830 3796099 Dual sensor radiation pyrometer Method of and apparatus for detecting corrosion utilizing infrared analysis Pyrometer #2 Method of and apparatus for thermographic identification of parts InventorsAssigneeApplicationNo. 911609 filed on 07/10/1992US Classes:374/121, By thermally emitted radiation250/227.11, Light conductor250/338.1, Infrared responsive250/341.4, With semiconductor sample250/341.8, Measuring infrared radiation reflected from sample356/43, OPTICAL PYROMETERS374/124, With scanning or temperature distribution display374/126, Having emissivity compensating or specified radiating surface374/128, Having significant signal handling circuitry (e.g., linearizing, emissivity compensation)374/131, With radiation conducting element374/137, Temperature distribution or profile374/161Change of optical propertyExaminersPrimary: Cuchlinski, William A. Jr.Assistant: Gutierrez, Diego Attorney, Agent or FirmForeign Patent References
International ClassG01J 005/10AbstractA multi-point non-invasive, real-time pyrometry-based temperature sensor (200) for simultaneously sensing semiconductor wafer (22) temperature and compensating for wafer emissivity effects. The pyrometer (200) measures the radiant energy that a heated semiconductor wafer (22) emits and coherent beams of light (224) that the semiconductor wafer (22) reflects. As a result, the sensor (200) generates accurate, high-resolution multi-point measurements of semiconductor wafer (22) temperature during a device fabrication process. The pyrometer (200) includes an infrared laser source (202) that directs coherent light beam (203) into beam splitter (204). From the beam splitter (204), the coherent light beam (203) is split into numerous incident coherent beams (210). Beams (210) travel via optical fiber bundles (218) to the surface of semiconductor wafer (22) within the fabrication reactor (80). Each optical fiber bundle (218) collects reflected coherent light beam and radiant energy from wafer (22). Reflected coherent light beam (226) and radiant energy (222) is directed to a detector (240) for detecting signals and recording radiance, emissivity, and temperature values. Multiple optical fiber bundles (218) may be used in the sensor (200) for high spatial resolution multi-point measurements of wafer (22) temperature for precision real-time process control and uniformity optimizations.Field of SearchHaving emissivity compensating or specified radiating surfaceComparison with radiation reference standard Having significant signal handling circuitry (e.g., linearizing, emissivity compensation) EMISSIVITY DETERMINATION With radiation conducting element With scanning or temperature distribution display Temperature distribution or profile By thermally emitted radiation Change of optical property Infrared responsive Light conductor With light chopping or modulation OPTICAL PYROMETERS | |