U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method and device for cutting a multilayer assembly composed of a plurality of thin films and comprising a thin film electrochemical generator or a component part thereof

Patent 5250784 Issued on October 5, 1993. Estimated Expiration Date: Icon_subject October 24, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3917769

Method of and means for cutting hose for high pressure hydraulic systems
Patent #: 4048464
Issued on: 09/13/1977
Inventor: Gale ,   et al.

Method and apparatus for producing safety belts with reduced kerfs
Patent #: 4149918
Issued on: 04/17/1979
Inventor: Cislak

Method for machining a workpiece with a beam of radiant energy assisted by a chemically-reactive gas
Patent #: 4332999
Issued on: 06/01/1982
Inventor: Wittke

Laser cutting of composite materials
Patent #: 4639572
Issued on: 01/27/1987
Inventor: Gruzman ,   et al.

Apparatus for cutting multiple layers of fabric
Patent #: 4680442
Issued on: 07/14/1987
Inventor: Bauer ,   et al.

Method and apparatus for slitting metal strips
Patent #: 4782208
Issued on: 11/01/1988
Inventor: Withrow ,   et al.

Method of assembling components of an electrochemical generator using thin films of lithium Patent #: 4897917
Issued on: 02/06/1990
Inventor: Gauthier, et al.

Inventors

Assignee

Application

No. 768551 filed on 10/24/1991

US Classes:

219/121.72, Methods219/121.84With fluid supply

Examiners

Primary: Albritton, C. L.

Attorney, Agent or Firm

Foreign Patent References

  • 224113 EP. 06/13/1987
  • 2616970 FR. 12/13/1988

International Class

B23K 026/00

Foreign Application Priority Data

1990-01-30 FR

Abstract

At least one laser beam is focused on one side of an assembly to be cut at a point on the side which is part of the cutting profile and which is called the point of impact of the beam on side side, in order to cause at that point a disintegration of the material of the assembly. The laser beam is moved in relation to the assembly so that the impact point describes a trajectory which corresponds to the desired cutting profile, while maintaining a controlled atmosphere in the area around the impact point. Uses particularly include cutting solid polymer electrolyte lithium thin film electrochemical generators, or cutting precursors of such generators.

Other References

  • Patent Abstracts of Japan vol. 6, No. 182 (E-131) (1060), 18 Sep. 1982, & JP-A-57 96472 (Hitachi Maxell K.K.) 15 Jun. 198
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