Means for measuring coplanarity of leads on an IC package
July 15, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for automatically recognizing faults in the surface of the dimensions of an object Apparatus for monitoring crystal growth Apparatus for automatically inspecting electrical connecting pins Apparatus and method for inspecting soldered portions Methods and apparatus for optical product inspection Optical device for the observation of an elongated object Patent #: 5125052 InventorAssigneeApplicationNo. 729921 filed on 07/15/1991US Classes:382/146, Measuring external leads348/126, Of electronic circuit chip or board359/710, Cylindrical382/298To change the scale or size of an imageExaminersPrimary: Moore, David K.Assistant: Johns, Andrew W. Attorney, Agent or FirmForeign Patent References
International ClassG06K 009/00Foreign Application Priority Data1990-07-17 JPAbstractA coplanarity measuring apparatus includes an image converting section, an optical lens mechanism, an image processing section, and an arithmetic operating section. The image converting section converts a transmission image of lead end portions of a surface-mount type IC package into image data. The optical lens mechanism vertically enlarges a transmission image, of the lead end portions, which is projected by the image converting section, and horizontally reduces the vertically enlarged transmission image. The image processing section converts the image data output from the image converting section into binary data and forming a profile. The arithmetic operating section calculates a coplanarity from the profile formed by the image processing section and checks whether a product is defective. | |
