Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
Patent 5248710 Issued on September 28, 1993. Estimated Expiration Date: 
May 28, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 28, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesEpoxy resin composition Semiconductor encapsulating epoxy resin compositions and semiconductor devices Patent #: 5096762 InventorsAssigneeApplicationNo. 889369 filed on 05/28/1992US Classes:523/435, Solid polymer derived from reactant containing element other than C, H, O, or N or chlorine-containing reactant of three or more carbon atoms257/E23.121, Containing filler (EPO)528/21, Material is a nitrogen-containing compound528/27Organic Si-free reactant contains a heterocyclic ringExaminersPrimary: Marquis, Melvyn I.Assistant: Aylward, D. Attorney, Agent or FirmInternational ClassC08L 063/02Foreign Application Priority Data1991-05-29 JPAbstractA composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a silicone-modified epoxy resin, (C) an imidazole curing agent having a solubility of up to 0.1% by weight in epoxy resin (A) at 25° C., and (D) fused silica having a mean particle size of up to 10 μm and adjusted to a viscosity of up to about 4,000 poise at 25° C. satisfies the requirements for flip chip encapsulation since the composition has improved shelf stability and filling ability and cures into products having improved moisture resistance. Semiconductor devices encapsulated with cured products of the composition remain reliable because of moisture resistance. | |
