Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal
Patent 5242759 Issued on September 7, 1993. Estimated Expiration Date: 
May 21, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 21, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2858600 2882593 2906008 3002265 3037880 3923609 Apparatus containing silicon metal joints Method of applying a firmly adherent metallic coating to titanium and titanium alloy Sealing cover for an hermetically sealed container Ti-base material for eyeglass-frames and a method for producing same InventorAssigneeApplicationNo. 703493 filed on 05/21/1991US Classes:428/610, Having composition, density, or hardness gradient228/207, Applying flux228/262.72, Brazing or soldering427/309, Inorganic base427/310, Fluxing428/660Refractory (Group IVB, VB, or VIB) metal-base componentExaminersPrimary: Zimmerman, John J.Attorney, Agent or FirmForeign Patent References
International ClassesB32B 005/14B32B 015/00 B23K 035/363 AbstractA joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.Other References
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