U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Fluid flow control method and apparatus for minimizing particle contamination

Patent 5240046 Issued on August 31, 1993. Estimated Expiration Date: Icon_subject July 15, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Pressure sensing method and apparatus for gases
Patent #: 3963043
Issued on: 06/15/1976
Inventor: Cota ,   et al.

Generation of high vacuums
Patent #: 4172477
Issued on: 10/30/1979
Inventor: Reich

Method of producing a high vacuum in a container
Patent #: 4181161
Issued on: 01/01/1980
Inventor: Kraus

Pressure regulator for fluid pressures
Patent #: 4253480
Issued on: 03/03/1981
Inventor: Kessel ,   et al.

Mass flow/pressure control system
Patent #: 4373549
Issued on: 02/15/1983
Inventor: Nalepa ,   et al.

Method and apparatus for regulating fluid flow
Patent #: 4690163
Issued on: 09/01/1987
Inventor: Steinemann

Method and apparatus for improving the yield of integrated circuit devices
Patent #: 4739787
Issued on: 04/26/1988
Inventor: Stoltenberg

Method and apparatus for venting vacuum processing equipment
Patent #: 4836233
Issued on: 06/06/1989
Inventor: Milgate, III

Pressure regulator Patent #: 4936340
Issued on: 06/26/1990
Inventor: Potter, et al.

Inventor

Application

No. 913731 filed on 07/15/1992

US Classes:

141/8, Vacuum137/14, Involving pressure control141/4Gas or variation of gaseous condition in receiver

Examiners

Primary: Recla, Henry J.
Assistant: Jacyna, Casey

Attorney, Agent or Firm

International Classes

G05D 016/00
F16K 024/04

Abstract

A fluid flow control for use with a process chamber. In the disclosed embodiment, the process chamber is for ion implantation of a workpiece and the fluid flow control is to assure the flow rates are maintained at values which are efficient in evacuating and pressurizing the chamber but are not high enough to dislodge particulate contaminants from the process chamber walls. In the disclosed design, the invention has utility both in instances in which wafers are directly inserted into the process chamber for ion implantation and in which the wafers are inserted into the chamber by use of a load-lock which avoids the requirement that the process chamber be cyclicly pressurized and depressurized.

PatentsPlus Images
Enhanced PDF formats
loading...
PatentsPlus: add to cart
PatentsPlus: add to cartSearch-enhanced full patent PDF image
$9.95more info
PatentsPlus: add to cart
PatentsPlus: add to cartIntelligent turbocharged patent PDFs with marked up images
$18.95more info
 
Sign InRegister
Username  
Password   
forgot password?