Overmolded semiconductor device having solder ball and edge lead connective structure

Patent 5239198 Issued on August 24, 1993. Estimated Expiration Date:

July 2, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

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Inventors

Assignee

Motorola, Inc.

Application

No. 907970 filed on 07/02/1992

US Classes:

257/693, External connection to housing257/691, Having power distribution means (e.g., bus structure)257/779, Solder wettable contact, lead, or bond257/787, ENCAPSULATED257/E21.502, Encapsulation, e.g., encapsulation layer, coating (EPO)257/E23.064For flat cards, e.g., credit cards (EPO)

Examiners

Primary: Hille, Rolf
Assistant: Clark, S. V.

Attorney, Agent or Firm

Clingan, Jr.; James L.

International Classes

H01L 023/12
H01L 023/14
H01L 023/48

Foreign Application Priority Data

1989-09-06 JP

Abstract

A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A first semiconductor die (20) is interconnected to the first traces (14), and a package body (24) is formed around the first die and a portion of the traces. A second semiconductor die (26) is interconnected to the second traces (16) on the second surface. A second package body (28) is formed around the second die and a portion of the traces (16). Solder balls (32) are coupled to exposed portions of the second traces (16) around the perimeter of the package body (28) to establish external power and ground connections to each die. Edge leads (36) are externally soldered to the traces (14 & 16) around the periphery of the substrate (12) to establish remaining electrical connections.