U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Semiconductor object pre-aligning apparatus

Patent 5238354 Issued on August 24, 1993. Estimated Expiration Date: Icon_subject April 24, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Surface measurement instruments
Patent #: 4026031
Issued on: 05/31/1977
Inventor: Siddall ,   et al.

Wafer alignment station
Patent #: 4457664
Issued on: 07/03/1984
Inventor: Judell ,   et al.

Edge finding in wafers
Patent #: 4752898
Issued on: 06/21/1988
Inventor: Koenig

Apparatus for aligning circular objects
Patent #: 4765793
Issued on: 08/23/1988
Inventor: Goddeau

Method and system for locating and positioning circular workpieces
Patent #: 4833790
Issued on: 05/30/1989
Inventor: Spencer ,   et al.

Wafer handling system
Patent #: 4846626
Issued on: 07/11/1989
Inventor: Engelbrecht

Wafer centration device
Patent #: 4880348
Issued on: 11/14/1989
Inventor: Baker, et al.

Device for positioning a semi-conductor wafer
Patent #: 4887904
Issued on: 12/19/1989
Inventor: Nakazato, et al.

Universal edged-based wafer alignment apparatus
Patent #: 4907035
Issued on: 03/06/1990
Inventor: Galburt, et al.

Automated wafer inspection system Patent #: 4938654
Issued on: 07/03/1990
Inventor: Schram

Inventor

Assignee

Application

No. 873368 filed on 04/24/1992

US Classes:

414/779, Article support means rotates about a shiftable pivot point356/400, With light detector (e.g., photocell)414/936Including wafer orienting means

Examiners

Primary: Huppert, Michael S.
Assistant: Hienz, William M.

Attorney, Agent or Firm

Foreign Patent References

  • 0278462 EP. 08/19/1988

International Class

B65G 047/24

Abstract

A prealigner for semiconductive wafers is described. The prealigner includes mechanism for holding the wafer in a non-slip manner and motive means for adjusting the position of its engagement with the wafer as necessary to make the geometric center of the wafer precisely coincident with a chosen position.

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