Process for manufacturing a multi-layer lead frame
October 13, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2969300 3597816 3811187 Method for packaging hermetically sealed integrated circuit chips on lead frames Apparatus for securing tape to leads of semiconductor lead frame Tape applying device Scrap-less taping system for IC lead-frames Tape attach machine Method of making a multilayer molded plastic IC package Taping apparatus for lead frame InventorsAssigneeApplicationNo. 960575 filed on 10/13/1992US Classes:29/830, Assembling bases29/25.01, BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING29/429, Progressively advancing of work assembly station or assembled portion of work156/261, Punching and bonding pressure application by punch257/E23.035, Additional leads being multilayer (EPO)257/E23.066Lead frames fixed on or encapsulated in insulating substrates (EPO)ExaminersPrimary: Eley, Timothy V.Attorney, Agent or FirmForeign Patent References
International ClassesB32B 031/18H05K 003/36 Foreign Application Priority Data1990-05-18 JPAbstractA process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.Other References
Field of SearchBeam lead frame or beam lead deviceAssembling bases Assembling formed circuit to base By metal fusion bonding Progressively advancing of work assembly station or assembled portion of work Advancing work to successive stations (i.e., assembly line) BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING With cutting, punching, tearing or severing Perforating lamina Subsequent to assembly of laminae Prior to assembly Punching and bonding pressure application by punch Means feeding plural workpieces to be joined Severing means or member secured thereto also bonds Cutter actuated by or secured to bonding element | |
