Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor
Patent 5229327 Issued on July 20, 1993. Estimated Expiration Date: 
October 21, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 21, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesThermoelectric device and method of making and using same Patent #: 4489742 InventorApplicationNo. 781087 filed on 10/21/1991US Classes:438/122, Possessing thermal dissipation structure (i.e., heat sink)257/E23.082, Cooling arrangements using Peltier effect (EPO)438/584COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIALExaminersPrimary: Chaudhuri, OlikAssistant: Graybill, David E. Attorney, Agent or FirmForeign Patent References
International ClassesH01L 021/58H01L 021/60 H01L 023/38 AbstractA method for utilizing a single series operating current for providing operating power to an electronic device and adjacent cooling therefor while simultaneously increasing or decreasing the cooling in a manner directly proportional to increases and decreases in power consumption and heat dissipation from the electronic device. The electronic device is connected to a first power supply terminal and a Peltier cooling junction is connected to one side of the electronic device. A Peltier heating junction is connected to one side of the Peltier cooling junction remote from the electronic device, and a heat sink is connected between the Peltier heating junction and a second power supply terminal. In this manner, a single series electrical circuit may be used for simultaneously providing operating power to the electronic device and cooling the electronic device in proportion to heat dissipation requirements therefor. Advantageously, the Peltier cooling and heating junctions may be formed in a planar fashion on the surface of a semiconductor die and used to cool integrated circuits which are fabricated within the die. | |
