Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
Patent 5221038 Issued on June 22, 1993. Estimated Expiration Date: 
October 5, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 5, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3292240 3839727 Method and connecting material for the metallic joining of parts Apparatus and method for aligning surface mountable electronic components on printed circuit board pads Method of building solder bumps Bonding of metallic surfaces Interconnection structure and test method Solder/polymer composite paste and method Patent #: 5062896 InventorsAssigneeApplicationNo. 956236 filed on 10/05/1992US Classes:228/180.22, Lead-less (or "bumped") device228/197With diffusion of atoms or nuclear particlesExaminersPrimary: Rosenbaum, MarkAssistant: Elpel, Jeanne M. Attorney, Agent or FirmInternational ClassesB23K 020/233B23K 101/36 H05K 003/34 AbstractA solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, preferably by electrodeposition, to a first faying surface (18). Following assembling with a second faying surface (22), the assembly is heated to melt the solder deposit, whereupon tin from the tin plate dissolves into the solder liquid to form a tin-enriched alloy having an increased melting temperature.Other References
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