Semiconductor device with controlled spread polymeric underfill
December 23, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesFramed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips Preferred device orientation on integrated circuits for better matching under mechanical stress Multi-lead frame member with means for limiting mold spread Method for encapsulating electronic devices Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips Structure and method of packaging a semiconductor device Patent #: 5107325 InventorsAssigneeApplicationNo. 811841 filed on 12/23/1991US Classes:257/787, ENCAPSULATED257/738, Ball shaped257/774, Via (interconnection hole) shape257/778, Flip chip257/792, Including polyimide257/E21.502, Encapsulation, e.g., encapsulation layer, coating (EPO)257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E23.129, Partial encapsulation or coating (EPO)257/E23.136, Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (EPO)361/773Shaped lead on componentsExaminersPrimary: James, Andrew J.Assistant: Whitehead, Carl Jr. Attorney, Agent or FirmInternational ClassesH01L 023/28H01L 023/48 H01L 029/46 H01L 023/02 AbstractA semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate. | |
