Polishing pad conditioning apparatus for wafer planarization process
Patent 5216843 Issued on June 8, 1993. Estimated Expiration Date: 
September 24, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 24, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2826009 Polishing machine for ferrule of optical fiber connector Patent #: 4839993 InventorsApplicationNo. 950812 filed on 09/24/1992US Classes:451/285, Rotary work holder451/36, Utilizing fluent abradant451/56, With tool treating or forming451/287, Planar surface abrading451/398, Rotary work holder451/446, Abradant supplying451/550Disk lapsExaminersPrimary: Kisliuk, Bruce M.Assistant: Morgan, Eileen P. Attorney, Agent or FirmInternational ClassesB24B 029/00209 DL 277 AbstractAn improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad. | |
