U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method for bonding thin film thermocouples to ceramics

Patent 5215597 Issued on June 1, 1993. Estimated Expiration Date: Icon_subject June 1, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3006978

3890456

3911386

Oxygen sensor having thin film electrolyte
Patent #: 4040929
Issued on: 08/09/1977
Inventor: Bauer ,   et al.

Chemical bonding of metals to ceramic materials
Patent #: 4050956
Issued on: 09/27/1977
Inventor: de Bruin ,   et al.

Method of making a metalized substrate having a thin film barrier layer
Patent #: 4153518
Issued on: 05/08/1979
Inventor: Holmes ,   et al.

Pyrometric sheath and process
Patent #: 4238957
Issued on: 12/16/1980
Inventor: Bailey ,   et al.

Electrode sputtering process for exhaust gas oxygen sensor
Patent #: 4253931
Issued on: 03/03/1981
Inventor: Gold ,   et al.

Method of metallizing a ceramic substrate
Patent #: 4342632
Issued on: 08/03/1982
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Stainless steel primer for sputtered films
Patent #: 4512863
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Inventor: Criss ,   et al.

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Inventor

Assignee

Application

No. 390851 filed on 08/08/1989

US Classes:

136/225, Having strip, film or plate-type thermocouples136/200, THERMOELECTRIC136/230Having housing, mounting or support

Examiners

Primary: Walsh, Donald P.
Assistant: Carroll, Chrisman D.

Attorney, Agent or Firm

International Class

H01L 035/28

Abstract

A method is provided for adhering a thin film metal thermocouple to a ceramic substrate used in an environment up to 700 degrees Centigrade, such as at a cylinder of an internal combustion engine. The method includes the steps of: depositing a thin layer of a reactive metal on a clean ceramic substrate; and depositing thin layers of platinum and a platinum-10% rhodium alloy forming the respective legs of the thermocouple on the reactive metal layer. The reactive metal layer serves as a bond coat between the thin noble metal thermocouple layers and the ceramic substrate. The thin layers of noble metal are in the range of 1-4 micrometers thick. Preferably, the ceramic substrate is selected from the group consisting of alumina and partially stabilized zirconia. Preferably, the thin layer of reactive metal is in the range of 0.015-0.030 micrometers (15-30 nanometers) thick. The preferred reactive metal is chromium. Other reactive metals may be titanium or zirconium. The thin layer of reactive metal may be deposited by sputtering in ultra high purity argon in a vacuum of approximately 2 milliTorr (0.3 Pascals).

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