Vacuum infiltration of underfill material for flip-chip devices
Patent 5203076 Issued on April 20, 1993. Estimated Expiration Date: 
December 23, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 23, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSolder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making Pad grid array for receiving a solder bumped chip carrier Flip-chip package for integrated circuits Patent #: 5019673 InventorsAssigneeApplicationNo. 812332 filed on 12/23/1991US Classes:29/840, By metal fusion174/260, With electrical device257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)428/901PRINTED CIRCUITExaminersPrimary: Arbes, Carl J.Attorney, Agent or FirmForeign Patent References
International ClassH05K 003/34AbstractA method of attaching an integrated circuit (10) to a substrate (20) starts with electrically interconnecting (14) the integrated circuit on the substrate. Next, a bead of underfill material (22) is provided on the substrate (20) about the periphery (24) of the integrated circuit (10). At least a partial vacuum (34) is then applied to the integrated circuit (10) and the substrate (20) to substantially evacuate the area (18) between the integrated circuit (10) and the substrate (20). Finally, fluid pressure (42) is applied to the integrated circuit (10) and the substrate (20) to force at least a portion of the underfill material (22) into the area (18) between the integrated circuit (10) and the substrate (20).Other References
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