Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
August 12, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3320658 3396894 3458925 3871015 Method and apparatus for soldering electric terminals to double-sided circuit boards Multilayer flexible printed circuit tape Method for making terminal bumps on semiconductor wafers Method of forming solder bump terminals on semiconductor elements Solder delivery system Photosensitive coating composition and the use thereof for protective purposes InventorsAssigneeApplicationNo. 743970 filed on 08/12/1991US Classes:29/830, Assembling bases29/831, Assembling formed circuit to base29/840, By metal fusion228/180.22, Lead-less (or "bumped") device228/215, By confining filler257/E23.065, Flexible insulating substrates (EPO)257/E23.069Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)ExaminersPrimary: Gorski, Joseph M.Assistant: Vo, Peter Attorney, Agent or FirmInternational ClassH05K 003/36AbstractA method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.Other References
Field of SearchBeam lead frame or beam lead deviceWith component orienting By metal fusion By metal fusion bonding With bonding Metal On flat or curved insulated base, e.g., printed circuit, etc. Assembling bases Assembling formed circuit to base Assembling to base an electrical component, e.g., capacitor, etc. Metallic Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) SOLDER FORM By confining filler Indefinite length Gas or vapor | |
