High strength, light weight Ti-Y composites and method of making same
Patent 5200004 Issued on April 6, 1993. Estimated Expiration Date: 
December 16, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 16, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2810640 3241930 Magnetic recording medium Method of preparing copper-dendritic composite alloys for mechanical reduction Getter wire High strength-high conductivity Cu--Fe composites produced by powder compaction/mechanical reduction Patent #: 5043025 InventorsApplicationNo. 808363 filed on 12/16/1991US Classes:148/527, With metal next to or bonded to metal148/538, With casting or solidifying from melt148/670, With working420/416, RARE EARTH METAL BASE SINGLY OR IN COMBINATION428/660Refractory (Group IVB, VB, or VIB) metal-base componentExaminersPrimary: Roy, UpendraAttorney, Agent or FirmInternational ClassB22F 007/00AbstractA high strength, light weight "in-situ" Ti-Y composite is produced by deformation processing a cast body having Ti and Y phase components distributed therein. The composite comprises elongated, ribbon-shaped Ti and Y phase components aligned along an axis of the deformed body.Other References
| |
