ApplicationNo. 738002 filed on 07/30/1991
US Classes:428/458, Next to polyester, polyamide or polyimide (e.g., alkyd, glue, or nylon, etc.)257/E21.517, Involving use of electron or laser beam (EPO)257/E23.055, Consisting of thin flexible metallic tape with or without film carrier (EPO)428/40.9, Metal containing428/482, Of cross-linked polyester428/483, Next to addition polymer from unsaturated monomers428/901, PRINTED CIRCUIT438/118Including adhesive bonding step
ExaminersPrimary: Sluby, P. C.
Attorney, Agent or Firm
International ClassesB32B 015/08
AbstractA method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the interconnect leads firmly in their proper position for bonding to an integrated circuit chip and to a leadframe or substrate such as a printed wiring board or a ceramic substrate for hybrid circuits. Either during or after bonding the interconnect leads to the leadframe or substrate, energy is applied to the adhesive holding the interconnect leads to the film and the film is detached from the interconnect leads in a manner which will not damage the leads due to the reduced adhesive strength. Thus, the leadframe package will not enclose the film.