U.S. patents available from 1976 to present.
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Thin-film structure for chalcogenide electrical switching devices and process therefor

Patent 5177567 Issued on January 5, 1993. Estimated Expiration Date: Icon_subject July 19, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3611063

3846767

Programmable cell for use in programmable electronic arrays
Patent #: 4599705
Issued on: 07/08/1986
Inventor: Holmberg ,   et al.

Method of fabricating stabilized threshold switching material
Patent #: 4804490
Issued on: 02/14/1989
Inventor: Pryor ,   et al.

Thin film overvoltage protection devices
Patent #: 4809044
Issued on: 02/28/1989
Inventor: Pryor ,   et al.

Thin film electrical devices with amorphous carbon electrodes and method of making same Patent #: 4845533
Issued on: 07/04/1989
Inventor: Pryor ,   et al.

Inventors

Assignee

Application

No. 732544 filed on 07/19/1991

US Classes:

257/4, With specified electrode composition or configuration257/3, With means to localize region of conduction (e.g., "pore" structure)257/760, Separating insulating layer is laminate or composite of plural insulating materials (e.g., silicon oxide on silicon nitride, silicon oxynitride)257/E45.002Bistable switching devices, e.g., Ovshinsky-effect devices (EPO)

Examiners

Primary: Hille, Rolf
Assistant: Saadat, Mahshid

Attorney, Agent or Firm

International Classes

H01L 045/00
H01L 027/02

Abstract

Disclosed herein is a novel thin-film structure for solid state thin-film electrical switching devices fabricated of chalcogenide material that overcomes a number of design weaknesses existing in the prior art. The novel structure of the instant invention employs a thin layer of insulating material beneath the body of chalcogenide material so as to carefully define the filament location. Since the filament location has been fixed, switching, due to edge conduction pathways has been substantially eliminated. At the same time, the use of a thin insulating layer precludes step coverage faults of the prior art. The requirement for the thin layer of insulator material to withstand the switching voltage is addressed through the use of a second thicker layer of insulator material which is deposited only after the chalcogenide material has been formed. This improved structure demonstrates the advantages of higher fabrication yields and more repeatable electrical switching characteristics.

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