Semiconductor device package and method of making such a package
June 25, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3435516 3885304 Semiconductor device package Package for an integrated circuit having a container with support bars Flat package for integrated circuit devices Method of producing a semiconductor device Integrated circuit packaging process Wire bonds and electrical contacts of an integrated circuit device Semiconductor package with high density I/O lead connection Data carrier having an integrated circuit and method for producing same InventorsAssigneeApplicationNo. 543989 filed on 06/25/1990US Classes:257/687, Housing or package filled with solid or liquid electrically insulating material29/855, With encapsulating257/668, On insulating carrier other than a printed circuit board257/E21.499, Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)257/E21.501, Providing fillings in container, e.g., gas fillings (EPO)257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.002, Details not otherwise provided for, e.g., protection against moisture (EPO)257/E23.065, Flexible insulating substrates (EPO)257/E23.126, Double encapsulation or coating and encapsulation (EPO)257/E23.14, Solid or gel at normal operating temperature of device (EPO)257/E23.193Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)ExaminersPrimary: James, Andrew J.Assistant: Nguyen, Viet Q. Attorney, Agent or FirmForeign Patent References
International ClassH05K 001/18AbstractA semiconductor device package and a method of making such a package is described. The package comprises a flexible packaging substrate having a patterned metal layer onto which a semiconductor die is attached and a patterned insulative layer attached to the metal layer. The insulative layer includes an annular epoxy-seal gap. A glob of silicone gel is deposited and cured on the die. A casting frame is connected to the metal layer of the flexible substrate on the same side as the die. A backside moisture-blocking layer of material is attached to an opposed side of the tape. The frame and the backside layer are attached to the metal layer of the flexible substrate using cross-linkable epoxy adhesives. These epoxy adhesives join through the epoxy-seal gap to define an epoxy-seal around the die. A thermoset type of molding compound is then poured into the casting frame to define a moisture resistant package body. | |
