Connecting of semiconductor chips to circuit substrates
February 21, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3793714 Method for mounting parts on circuit boards Method of mounting electronic components Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making Method of connecting a semiconductor device to a wiring board Optical writing head Method of packaging semiconductor device Method of connecting electrodes Patent #: 5012969 InventorsApplicationNo. 838979 filed on 02/21/1992US Classes:228/180.21, Component terminal to substrate surface (i.e., nonpenetrating terminal)228/212, With clamping or holding257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.119, Organic, e.g., plastic, epoxy (EPO)257/E23.125, Substrate forming part of encapsulation (EPO)438/15, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor438/118Including adhesive bonding stepExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/60AbstractA method and article made by such method are described for connecting electrodes on one face of an integrated circuit semiconductor device with those on a supporting substrate. The method comprises positioning electrodes formed on one face of the device into engagement with electrodes formed on the substrate. A force is applied to press the electrodes together and during application of the force a first adhesive is applied along only a minor portion of two edges of the device. The first adhesive is stiffened to provide a temporary connection of the device and the substrate. A mass of a second adhesive is applied over a face of said device opposite said one face and onto portions of the substrate adjacent the periphery of the device with substantially no adhesive located between the one face of the device and the substrate at a center area of the one face. The second adhesive is hardened to form an adhesive dome that permanently connects the device to the substrate. | |
