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Fabricating an electrically-erasable, electrically-programmable read-only memory having a tunnel window insulator and thick oxide isolation between wordlines

Patent 5156991 Issued on October 20, 1992. Estimated Expiration Date: Icon_subject January 31, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

MOS double polysilicon read-only memory and cell
Patent #: 4180826
Issued on: 12/25/1979
Inventor: Shappir

Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same
Patent #: 4203158
Issued on: 05/13/1980
Inventor: Frohman-Bentchkowsky ,   et al.

High density electrically programmable ROM
Patent #: 4258466
Issued on: 03/31/1981
Inventor: Kuo ,   et al.

High density, electrically erasable, floating gate memory cell
Patent #: 4317272
Issued on: 03/02/1982
Inventor: Kuo ,   et al.

High coupling ratio electrically programmable ROM
Patent #: 4326331
Issued on: 04/27/1982
Inventor: Guterman

Electrically erasable programmable read-only memory
Patent #: 4377857
Issued on: 03/22/1983
Inventor: Tickle

Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like
Patent #: 4493057
Issued on: 01/08/1985
Inventor: McElroy

Nonvolatile MOS memory cell with tunneling element
Patent #: 4590504
Issued on: 05/20/1986
Inventor: Guterman

Process for the fabrication of a nonvolatile memory cell with very small thin oxide area and cell
Patent #: 4622737
Issued on: 11/18/1986
Inventor: Ravaglia

Semiconductor device
Patent #: 4668970
Issued on: 05/26/1987
Inventor: Yatsuda ,   et al.

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Inventors

Assignee

Application

No. 648087 filed on 01/31/1991

US Classes:

438/263, Tunneling insulator257/E27.103, Electrically programmable ROM (EPO)257/E29.304, Charging by tunneling of carriers (e.g., Fowler-Nordheim tunneling) (EPO)438/298, Doping region beneath recessed oxide (e.g., to form chanstop, etc.)438/981UTILIZING VARYING DIELECTRIC THICKNESS

Examiners

Primary: Hearn, Brian E.
Assistant: Chaudhari, C.

Attorney, Agent or Firm

Foreign Patent References

  • 0105802 EP. 04/20/1984
  • 0144900 EP. 06/20/1985

International Classes

H01L 021/265
H01L 021/76

Abstract

An electrically-erasable, programmable ROM cell, or an EEPROM cell, is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small tunnel window, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. The bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window are near or above the channel side of the source. The window has a thinner dielectric than the remainder of the floating gate, to allow Fowler-Nordheim tunneling. By using dedicated drain or ground lines, rather than a virtual-ground layout, and by using thick oxide for isolation between bitlines, the floating gate can extend onto adjacent bitlines and isolation area, resulting in a favorable coupling ratio. Isolation between wordlines is also by thick thermal oxide in a preferred embodiment, further improving the coupling ratio. Bitline and wordline spacing may be selected for optimum pitch or aspect ratio. Bitline to substrate capacitance is minimized.

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