U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Plasma generating apparatus

Patent 5147493 Issued on September 15, 1992. Estimated Expiration Date: Icon_subject June 12, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

2457663

2637018

Long life incandescent switching system
Patent #: 4144477
Issued on: 03/13/1979
Inventor: Eaton

Method for controlling plasma etching rates
Patent #: 4222838
Issued on: 09/16/1980
Inventor: Bhagat ,   et al.

Plasma etching system
Patent #: 4617079
Issued on: 10/14/1986
Inventor: Tracy ,   et al.

Plasma etching system for minimizing stray electrical discharges
Patent #: 4626312
Issued on: 12/02/1986
Inventor: Tracy

Plasma amplified photoelectron process endpoint detection apparatus
Patent #: 4846920
Issued on: 07/11/1989
Inventor: Keller ,   et al.

Split-phase driver for plasma etch system
Patent #: 4871421
Issued on: 10/03/1989
Inventor: Ogle ,   et al.

Etching method and etching apparatus Patent #: 4931135
Issued on: 06/05/1990
Inventor: Horiuchi, et al.

Inventors

Assignee

Application

No. 714231 filed on 06/12/1991

US Classes:

156/345.44, Electrically coupled to a power supply or matching circuit118/723E, Having glow discharge electrodes (e.g., DC, AC, RF, etc.)204/298.06, Triode, tetrode, auxiliary electrode or biased workpiece204/298.34, Auxiliary electrode, bias means or specified power supply315/111.51Induction type

Examiners

Primary: Simmons, David A.
Assistant: Goudreau, George

Attorney, Agent or Firm

International Class

H01L 021/00

Foreign Application Priority Data

1990-06-15 JP

Abstract

A plasma generating apparatus comprising a transformer including a primary winding connected to a high frequency power source and a secondary winding having two end terminals and a plurality of tap terminals connected between the end terminals, the transformer being adapted to deliver first and second high frequency electric powers with a phase difference of 180° from the end terminals, upper and lower electrodes disposed in a vacuum chamber so as to be opposed at a distance from each other and supplied with the first and second high frequency powers, respectively, and a power ratio selector for switching the tap terminals to select the ratio between the first and second high frequency powers supplied to the electrodes, wherein a to-be-processed object placed on the lower electrode is processed by means of plasma formed between the electrodes.

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