Interconnection structure and test method
Patent 5147084 Issued on September 15, 1992. Estimated Expiration Date: 
August 9, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 9, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3719981 Polyimide coating process and material Methods for applying solder to an article Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making Patent #: 4604644 Inventors
ApplicationNo. 743048 filed on 08/09/1991US Classes:228/56.3, SOLDER FORM174/259, Adhesive/bonding174/263, With solder228/139, Using separate fastener228/175, Plural diverse bonding228/180.22, Lead-less (or "bumped") device228/215, By confining filler228/254, Adherent solid layer or coating (e.g., pretinned)257/48, TEST OR CALIBRATION STRUCTURE257/772, Solder composition257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E21.705Assembly of devices consisting of solid-state components formed in or on a common substrate; assembly of integrated circuit devices (EPO)ExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmInternational ClassesB23K 101/40H05K 003/34 H01L 021/60 AbstractDisclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.Other References
Field of SearchSOLDER FORMWith protecting of work or filler or applying flux By confining filler Attaching filler to work part Adherent solid layer or coating (e.g., pretinned) With supplementary mechanical joining Using separate fastener Plural diverse bonding Using bridge or spacer Adhesive/bonding With electrical device With particular conductive connection (e.g., crossover) With solder | |
