Method of fabricating metal printed wiring boards
Process for laminating a channeled photosensitive layer on an irregular surface
Hollow multilayer printed wiring board
Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers
Integrated circuit chip-and-substrate assembly
Multilayer circuit board fabricated from silicon
Method of forming solder terminals for a pinless ceramic module
Flexible coaxial cable apparatus and method
Modularized fabrication of high performance printed circuit boards
ApplicationNo. 605615 filed on 10/30/1990
US Classes:29/852, By forming conductive walled aperture in base29/830, Assembling bases174/36, Conductor only174/262, Feedthrough174/263With solder
ExaminersPrimary: Arbes, Carl J.
Attorney, Agent or Firm
International ClassH01K 003/10
AbstractA structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.