Electrical component package comprising polymer-reinforced solder bump interconnection
Patent 5120678 Issued on June 9, 1992. Estimated Expiration Date: 
November 5, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
November 5, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSolder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making Shaped solder pad for reflow soldering of surface mounting cylindrical devices on a circuit board Semiconductor resin package structure Patent #: 4825284 InventorsApplicationNo. 609483 filed on 11/05/1990US Classes:29/840, By metal fusion29/841, With encapsulating, e.g., potting, etc.228/175, Plural diverse bonding228/180.22, Lead-less (or "bumped") device257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)438/125Insulative housing or supportExaminersPrimary: Chaudhuri, OlikAssistant: Griffis, Andrew Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/56AbstractAn improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.Other References
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