U.S. patents available from 1976 to present.
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Bichannel radiation detection method

Patent 5114242 Issued on May 19, 1992. Estimated Expiration Date: Icon_subject December 7, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventors

Application

No. 624206 filed on 12/07/1990

US Classes:

374/128, Having significant signal handling circuitry (e.g., linearizing, emissivity compensation)374/126, Having emissivity compensating or specified radiating surface374/129Comparison with radiation reference standard

Examiners

Primary: Cuchlinski, William A. Jr.
Assistant: Gutierrez, Diego

Attorney, Agent or Firm

Foreign Patent References

  • 242044 AU. 12/12/1962
  • 0707105 CA 04/12/1965
  • 2339732 DE 02/12/1975
  • 0144513 JP 11/12/1980
  • 0160029 JP 10/12/1982
  • 0052531 JP 03/12/1983
  • 0139037 JP 08/12/1983
  • 131430 JP. 07/12/1985
  • 253939 JP. 12/12/1985
  • 130834 JP 06/12/1986
  • 62-50627 JP. 03/12/1987
  • 763698 SU. 12/12/1977
  • 1418579 SU 08/12/1988
  • 1212685 GB. 11/12/1970
  • 2045425 GB. 10/12/1980
  • 2082767 GB 03/12/1982

International Classes

G01J 005/62
G01J 005/60
G01J 005/54
G01J 005/10

Abstract

The system and method for pyrometrically determining the temperature of a semiconductor wafer within a processing chamber accurately determines the actual emissivity of the semiconductor wafer at a reference temperature using multiple pyrometers operating at different wavelengths. The pyrometers are calibrated for radiation received from the processing chamber and their responses are then corrected to provide the proper temperature indication for a master wafer at a known reference temperature to yield emissivity of the master wafer. Other similar wafers exhibiting extreme values of emissivity are sensed at the reference temperature to provide pyrometer responses that are corrected in accordance with the master emissivity, and such corrected responses are used to establish a correlation between emissivities and the corrected pyrometer responses. The corrected pyrometer responses on other wafers operating near the reference temperature can then be used with the emissivities to determine the true temperature of each such other wafer. The processing temperature of the wafer is then determined and controlled in accordance with the actual emissivity of the wafer for more precise thermal processing.

Other References

  • "Temperature Measurement Validity for Dual Spectral-Band Radiometric Techniques" by Fehribach/Johnson: Optical Engineering (Dec. 1989)
  • "On the Validity and Techniques of Temperature and Emissivity Measurements", by Fehribach, Johnson and Feng: University of Alabama in Huntsville (1988)
  • "Dual-Wavelength Radiation Thermometry: Emissivity Compensation Algorithms", by Tsai, Shoemaker, et al.; International Journal of Thermophysics (May 1989)
  • Summary of Splinter Workshop on "Materials Thermal & Thermoradiative Properties/Characterization Technology", by DeWitt/Ho; JPL Publication 89-16 (Jun. 1989)
  • "Industrial Radiation Thermometry", by Albert S. Tenney; Mechanical Engineering, (Oct. 1988)
  • "Advances in Dual-Wavelength Radiometry", by W. R. Barron, Sensors (Jan. 1990
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