Compliant thermally conductive compound
Patent 5094769 Issued on March 10, 1992. Estimated Expiration Date: 
March 10, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 10, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3405066 3495133 3882033 Non-bleeding thixotropic thermally conductive material Patent #: 4265775 Inventors
ApplicationNo. 193475 filed on 05/13/1988US Classes:252/71, HEAT-EXCHANGE, LOW-FREEZING OR POUR POINT, OR HIGH BOILING COMPOSITIONS252/62.3T, Thermoelectric252/73, Organic components252/74, Metal compounds or inorganic components (except water)252/75, Organic compounds of nonmetals other than C, H, and O252/77, Organic compounds of nonmetals other than C, H, and O252/78.1, Organic compounds of nonmetals other than C, H, O, and N252/78.3, Organic Si containing compounds252/572, Metal- or insoluble component-containing; e.g., slurry, grease, etc.252/573, Si-containing252/574B-, P-, S-, Se-, or Te-containingExaminersPrimary: Barr, JosephineAttorney, Agent or FirmInternational ClassesB09K 005/00H01B 003/20 AbstractA compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.Other References
Field of SearchMetal- or insoluble component-containing; e.g., slurry, grease, etc.Si-containing N-containing ELECTRICALLY CONDUCTIVE OR EMISSIVE COMPOSITIONS FROST-PREVENTING, ICE-THAWING, THERMOSTATIC, THERMOPHORIC, OR CRYOGENIC HEAT-EXCHANGE, LOW-FREEZING OR POUR POINT, OR HIGH BOILING COMPOSITIONS Organic components Metal compounds or inorganic components (except water) Organic compounds of nonmetals other than C, H, and O Organic compounds of nonmetals other than C, H, and O Organic compounds of nonmetals other than C, H, O, and N Organic Si containing compounds B-, P-, S-, Se-, or Te-containing Pigment containing coating Silicon compound containing coating Resin, rubber, or hardenable oil containing coating With filler, dye or pigment Liquid filled | |
